Proceedings of the ... International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of the ... International Symposium on the Physical and Failure Analysis of Integrated Circuits

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Recently it has been shown that the circuit delay can be reduced by using a self- aligned CoWP cap instead of a dielectric ... Failing vias in the stress migration structures were identified using externally induced voltage alterations (XIVA)[1 1].


Title:Proceedings of the ... International Symposium on the Physical and Failure Analysis of Integrated Circuits
Author: Chih-Hang Tung, IEEE Singapore Section. Reliability/CPMT/EDS Chapter, IEEE Electron Devices Society
Publisher: - 2005-01-01
ISBN-13:

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