Low Dielectric Constant Materials for IC Applications
Low dielectric materials are an important component of microelectronic devices. In this carefully edited volume the leading researchers give an introduction to and a survey of the various fields of dielectrics for IC integration. The book appeals to materials reserachers, electrical engineers and advanced students.The interconnect packing density requirement has led to a reduction in the wiring pitch (sum of the metal line width and the spacing between the metal lines) to increase the wiring density. Unfortunately, as the interconnect wiring densityanbsp;...
| Title | : | Low Dielectric Constant Materials for IC Applications |
| Author | : | Paul S. Ho, Jihperng Leu, Wei William Lee |
| Publisher | : | Springer Science & Business Media - 2003 |
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