Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005
... go to Golden Kao and Raymond Wang for ANSYS stress analysis, Mark Li and Samuel Wu for electromagnetic simulation. ... 1 . http:- dlp.com dip technology default. asp 2. http://www.analog.com/UploadcdFilcs/Packagcs 18934642 6E 8. pdf 3. ... and H. Reichl aquot;Fatigue life models for Sn4Ag0.5Cu and SnPb solder joints evaluated by experiments and simulationaquot;. ... AuSn Metallurgyaquot;, 1994 IEEE/ CMPT International Electronics Manufacturing Technology Symposium, pp. 1 77- 1 84. 14.
| Title | : | Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 |
| Author | : | American Society of Mechanical Engineers. Electronic and Photonic Packaging Division |
| Publisher | : | Amer Society of Mechanical - 2005-06-30 |
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